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In this equipment, a silicon dioxide (SiO2) film is formed on the wafer surface using high temperatures, oxygen and water vapor. At the same time, gaseous impurities are introduced in order to create the desired semiconductor characteristics.
 
Applications
Select a semiconductor manufacturing application (below) and you will be presented with the optimum sensing and control solution offered by Yamatake products. [Acrobat Reader required]
 
 





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