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Flip Chip Bonder
This equipment aligns a chip's pins with the pins of a package or PCB, brings them into contact, and then fixes them with the rapid and simultaneous application of heat and pressure.
 
Applications
Select a semiconductor manufacturing application (below) and you will be presented with the optimum sensing and control solution offered by Yamatake products. [Acrobat Reader required]
 
     
 
 



 
 

Address: 3323 Kifer Rd.; Santa Clara, CA; 95051 Phone: 1-866-SENSOR1 Fax: 1-602-216-8211
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